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  1. Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

    Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

    Xing-Chang Wei
    CRC PRESS 19.09.2017 - 2017
    Nar: - 322 S. PDesc:
    Sofort lieferbar - Sofort lieferbar

    Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Pa...

    65,25 €
    2,90 € Alle Preise inkl. MwSt | zzgl. Versand 2,90 €
  2. Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

    Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

    Xing-Chang Wei
    CRC PRESS 19.09.2017 - 2017
    Nar: - 322 S. PDesc:
    Sofort lieferbar - Sofort lieferbar

    Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Pa...

    65,25 €
    2,90 € Alle Preise inkl. MwSt | zzgl. Versand 2,90 €
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